Cosmetic co-removal of material for electronic device surfaces

ABSTRACT

This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation patent application of U.S. patentapplication Ser. No. 15/134,621, filed Apr. 21, 2016 and titled“Cosmetic Co-Removal of Material for Electronic Device Surfaces,” whichis a continuation patent application of U.S. patent application Ser. No.12/794,496, filed Jun. 4, 2010 and titled “Cosmetic Co-Removal ofMaterial for Electronic Device Surfaces,” which claims the benefit ofU.S. Provisional Patent Application No. 61/300,780, filed Feb. 2, 2010and titled “Handheld Device Enclosure,” U.S. Provisional PatentApplication No. 61/325,625, filed Apr. 19, 2010 and titled ElectricallyInsulating Connection Between Conductive Components,” and U.S.Provisional Patent Application No. 61/325,786, filed Apr. 19, 2010 andtitled “Cosmetic Co-Grinding of Electronic Device Surfaces,” thedisclosures of which are hereby incorporated by reference herein intheir entireties.

BACKGROUND

A portable electronic device can be constructed using differentapproaches. In some cases, an electronic device can be constructed byassembling several components together. The components can includeexternal components combining to form a device enclosure, as well asinternal components providing different functionality to the device. Forexample, an electronic device enclosure can include an integralcomponent, or a component constructed from a single material (e.g., ahousing member). Such a component can provide substantial structuralintegrity, as there may be no seams or gaps limiting the resistance ofthe component to applied external forces.

In some cases, a component of an electronic device can be used as partof an electrical circuit. For example, a component can provideelectrical functionality to another component of a device (e.g., serveas a resistor or as a capacitor for a processor). As another example, acomponent can be part of an antenna assembly of an electronic device. Ifthe component is used in only a single electrical circuit, the componentcan be constructed from a single piece of conductive material. If thesame component, however, is used in several different electricalcircuits, the component may need to be constructed from severalconductive elements separated by a non-conductive or insulating element.For example, first and second conductive elements can be connectedtogether by an insulating intermediate element.

The insulating element can be connected to conductive elements of acomponent using any suitable approach. In some embodiments, theinsulating element can extend beyond an interface between the insulatingelement and a conductive element as a result of the manufacturingprocess used to connect the conductive elements together using theinsulating element. For example, a molded insulating element can includeexcess material that seeped through a seam of a mold. When themulti-element component is part of the electronic device enclosure, theexcess material can adversely affect a user's enjoyment of the device.For example, the excess material can catch on a user's hand or clothing.As another example, the excess material can increase a user's odds ofdropping and breaking the electronic device. As still another example,the excess material can adversely affect the aesthetic appearance of thedevice.

SUMMARY

This is directed to simultaneously processing several differentmaterials forming a single surface of an electronic device component todefine a continuous component surface extending over an interface orseam between the different materials. In particular, this is directed toproviding a component constructed by combining several elements, andremoving material from at least two of the several elements to provide acontinuous and cosmetically pleasing surface across interfaces betweenthe elements. The several elements can be formed from at least twodifferent materials having different material properties.

An electronic device component can be constructed by connecting twoelements together using an intermediate element formed from a materialother than that used for at least one of the two elements. For example,the two elements can be constructed from a conductive material (e.g.,metal), while the intermediate element can be constructed from aninsulating material (e.g., plastic). The materials used can havedifferent properties including, for example, different mechanical,manufacturing, electrical, and thermal properties (e.g., materialshaving different manufacturing or mechanical hardness). The differentproperties of the materials can require different processes for cuttingor removing portions of the materials including, for example, differenttools, different settings for a single tool, or different manufacturingprocesses (e.g., different machines).

To create an aesthetically pleasing component, and in particular toremove excess material from one or more of the elements to provide acontinuous surface across an interface between adjacent elements of thecomponent, one or more finishing processes can be applied to theconnected elements. In some cases, a single tool or process can be usedto finish a surface that includes several elements constructed fromdifferent materials. For example, a single tool can be used for anentire component. As another example, a tool can be used for each ofseveral different surfaces of a component (e.g., surfaces on differentplanes). Because of the different material properties of the elements,however, the manner in which the process or tool is applied (e.g.,rotation speed, or application force) can vary based on the elementbeing processed. In some cases, the process can dynamically adjustsettings based on the particular element being processed. In othercases, the process can apply settings that correspond to a softer ofseveral materials.

Any suitable type of finishing process can be applied to a component.For example, a process can remove excess material, smooth out bumps,fill valleys or holes, or perform any other operation required toprovide a continuous and uniform surface across an interfaces betweenelements connected together in the component. Such a process caninclude, for example, a polishing or grinding operation. By processingthe component post-assembly (e.g., once individual elements have beenconnected together), the resulting component may have continuousexternal surfaces and even appear to be formed from a unitary piece ofmaterial, despite being the combination of several elements. Byprocessing the component using a single tool or a single step, themanufacturing process for the component can be shortened.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the present invention, its nature andvarious advantages will be more apparent upon consideration of thefollowing detailed description, taken in conjunction with theaccompanying drawings in which:

FIG. 1 is a schematic view of an illustrative outer periphery memberconstructed by connecting several elements together in accordance withone embodiment of the invention;

FIG. 2 is a schematic view of an illustrative electronic devicecomponent in accordance with one embodiment of the invention;

FIGS. 3A-3C are schematic top views of illustrative components thatincludes an intermediate element in accordance with some embodiments ofthe invention;

FIG. 4 is a schematic view of an illustrative component constructed fromseveral elements having different material properties in accordance withone embodiment of the invention;

FIG. 5 is a schematic view of an illustrative assembly for removingexcess material from front and back surfaces of a component constructedby connecting several elements in accordance with one embodiment of theinvention;

FIG. 6 is a schematic view of an illustrative assembly for removingexcess material from a closed ring component in accordance with oneembodiment of the invention;

FIG. 7 is a flowchart of an illustrative process for finishing acomponent constructed from elements of different materials in accordancewith one embodiment in the invention; and

FIG. 8 is a flowchart of an illustrative process for adjusting settingsof a finishing apparatus in accordance with one embodiment of theinvention.

DETAILED DESCRIPTION

An electronic device can include several components assembled togetherto form internal and external features of the device. For example, oneor more internal components (e.g., electrical circuitry) can be placedwithin external components (e.g., a housing) to provide a device havingdesired functionality. Different components can be manufactured usingseveral approaches including, for example, by assembling and connectingindividual elements together. In some cases, an external housingcomponent can be constructed by assembling several elements together toform an integral component.

FIG. 1 is a schematic view of an illustrative outer periphery memberconstructed by connecting several elements together in accordance withone embodiment of the invention. Outer periphery member 100 can beconstructed to form an exterior surface for an electronic device. Inparticular, outer periphery member 100 can surround or wrap around someor all of the electronic components such that outer periphery member 100defines an internal volume into which electronic device components canbe placed. For example, outer periphery member 100 can wrap around thedevice such that external surfaces 101 of outer periphery member 100define a left surface 102, a right surface 104, as well as a top surface106 and a bottom surface 108 of the device. To provide a desiredfunctionality to a user, the electronic device can include severalcomponents placed within the device, for example within the internalvolume of the outer periphery member.

The thickness, length, height, and cross-section of the outer peripherymember can be selected based on any suitable criteria including, forexample, based on structural requirements (e.g., stiffness, orresistance to bending, compression, tension or torsion in particularorientations). In some embodiments, the outer periphery member can serveas a structural member to which other electronic device components canbe mounted. Some of the structural integrity of outer periphery member100 can come from the closed shape that it defines (e.g., outerperiphery member 100 forms a loop).

Outer periphery member 100 can have any suitable cross-section. Forexample, outer periphery member 100 can have a substantially rectangularcross-section. In some embodiments, outer periphery member 100 caninstead or in addition have a cross-section in a different shapeincluding, for example, a circular, oval, polygonal, or curvedcross-section. In some embodiments, the shape or size of thecross-section can vary along the length or width of the device (e.g., anhourglass shaped cross-section).

The outer periphery member of an electronic device can be constructedusing any suitable process. In some embodiments, outer periphery member100 can be constructed by connecting element 110 and element 120together at interface 112, connecting element 120 and element 130together at interfaces 122, and connecting element 130 and element 110together at interface 132. The elements can have any suitable shapeincluding, for example, large L-shape element 110, small L-shape element120, and U-shape element 130. Each element can be constructedindividually and later assembled to form outer periphery member 100. Forexample, each element can be constructed using one or more of stamping,machining, working, casting, or combinations of these. In someembodiments, the materials selected for elements 110, 120 and 130 can beconductive to provide an electrical functionality to the device (e.g.,to serve as part of an antenna).

To join the individual elements together, intermediate elements 114, 124and 134 can be placed within interfaces 112, 122, and 132, respectively.In some embodiments, each of the intermediate elements can beconstructed from a material that can initially be provided in a firststate in which the material can flow between elements 110 and 120,elements 120 and 130, and elements 130 and 110 when placed in interfaces112, 122 and 132, respectively. The material can subsequently change toa second state in which the material bonds together elements 110 and120, 120 and 130, and 130 and 110, respectively, to form a single newcomponent (e.g., an integral component).

Different approaches can be used to connect individual componentelements together. For example, a mechanical fastener, connector orother connector piece can be coupled to several component elements thatare assembled together. A connector piece can have any suitable sizerelative to the elements being connected. In some cases, one or moreportions of the connector piece can extend along a side surface of anelement, or otherwise extend beyond a boundary defined by across-section of the elements (e.g., when two elements are connected endto end, such as outer periphery member elements, as described above inconnection with FIG. 1). In some cases, an adhesive can be used insteadof or in addition to a mechanical fastener or connector. For example, anadhesive layer can be placed between the components being connected. Theadhesive layer can be provided using any suitable approach including,for example, as a liquid or paste adhesive, tape, heat-based adhesive,or combination of these. In some embodiments, an adhesive layer can havea reduced thickness or width (e.g., reducing the space between theelements) to ensure that the elements are properly connected. This maybe due to mechanical properties of the adhesive, as a thicker layer ofthe adhesive may have limited strength in bending, compression, peeling,tension, or several of these.

While these approaches can be effective to couple elements together,they can also require the profile of a component to increase (e.g.,beyond the cross-section of the elements being connected) or can limitthe width or size of the connector (e.g., only allow a film layerbetween the elements). In addition, some of these approaches may requirethat the individual elements be accurately manufactured (e.g., with hightolerances) to ensure that the resulting component is also manufacturedwithin high tolerances. FIG. 2 is a schematic view of an illustrativeelectronic device component in accordance with one embodiment of theinvention. Component 200 can be constructed from first element 210 andsecond element 212, which can be connected by intermediate element 220.

First and second elements 210 and 212 can be constructed from anysuitable materials including, for example, the same or differentmaterials. For example, first and second elements 210 and 212 can beconstructed from one or more of a metal, plastic, a composite material,an organic material, or combinations of these. In some cases, one orboth of the elements can be constructed from conductive materials (andthus be used as part of circuitry within the device), but may need to beelectrically isolated from one another for proper functioning of devicecircuitry. In such cases, the intermediate element can be constructedfrom an insulating or dielectric material to prevent an electricalsignal from crossing the gap between first element 210 and secondelement 212. In some embodiments, the connecting element can beconstructed from a combination of conductive and insulating materials,where the insulating materials are disposed between the conductivematerials. Alternatively, one or more conductive materials can beembedded within insulating materials.

The individual elements of the component can be positioned using anysuitable approach. For example, individual elements can be aligned suchthat cross-sections of each element are aligned with each other (e.g.,the elements are non-overlapping). As another example, individualelements can be positioned relative to each other such that thecross-section of the portions of intermediate element 220 at theinterfaces with the first and second elements do not extend beyond thecross-sections of the first and second elements at the interfaces.

Intermediate element 220 can have any suitable size. For example,intermediate element 220 can have any suitable length (e.g., definingthe distance between first and second elements 210 and 212), including alength that is substantially the same size or larger than a lengthassociated with one or both of first and second elements 210 and 212.Alternatively, the length of intermediate element 220 can be less than alength associated with one or both of first and second elements 210 and212 (e.g., but at least 0.25 mm, such as 0.5 mm or 1 mm). In someembodiments, the length or shape of intermediate element 220 can beselected based on mechanical properties of the intermediate elementmaterial. For example, the intermediate element can include a variablewidth or cross section in the region between the elements.

In some embodiments, the size or shape of intermediate element 220 canvary between different components. For example, some or all of first andsecond elements 210 and 212 can be constructed with relatively lowtolerance, such that the length of arms or portions of the first andsecond elements that are placed in contact with the intermediate elementcan vary. In particular, first and second elements 210 and 212 can beinitially manufactured with lower tolerances, and then positioned in afixture having higher tolerances. Intermediate element 220 can be placedbetween the first and second elements. The material and process used toconnect intermediate element 220 between first and second elements 210and 212 can be selected such that the material can initially be providedin a first state in which the material can fill the gap or space, orspan the interface between the first and second elements. For example,the material can be provided as a liquid or a moldable solid (e.g., asoft clay-like state) such that the material can be shaped into anintermediate element. In some embodiments, the fixture can defineboundaries and features (e.g., protrusions or detents) within theintermediate element surfaces.

Once properly positioned between the first and second elements (e.g.,filling the gap between the elements), the material of the intermediateelement can change to a second state in which the material adheres toboth the first and second elements to provide a structurally sound bond(e.g., a mechanical bond) between them (e.g., the intermediate elementis integrated between the first and second elements). For example, thematerial can harden and provide structural integrity between the firstand second elements. Because the material can flow into any gap betweenthe first and second elements while in the first state, the material canabsorb or erase variations in the manufacturing of the first and secondmaterials due to low manufacturing tolerances of those elements, whileensuring that the resulting component is constructed with higherprecision than its individual components.

This approach may in addition reduce the complexity and detail requiredto construct the first and second elements. In particular, because thematerial of the intermediate element can flow in the first state, thematerial can flow around and into features of each of the first andsecond elements (as described below) to ensure that the material issecurely coupled to each of the first and second elements. Furthermore,this approach can be forgiving of imperfections and other manufacturingartifacts along the exposed surface of each of the first and secondelements. In fact, the opposing surfaces of the first and secondelements may not need to have corresponding features, as the opposingsurfaces of the first and second elements may not engage or need to beplaced in close proximity (e.g., as would otherwise be required with anadhesive). Instead, the material injected into the mold can flow aroundthe features, and accommodate any offsets or misalignments of thefeatures.

Any suitable process can be used to provide the material of theintermediate element between the first and second elements, and tochange the state of the material from the first state to the secondstate. In some embodiments, a molding process by which a material isinitially inserted in a liquid state and which subsequently hardens canbe used. For example, one or more of injection molding, compressionmolding, transfer molding, extrusion molding, blow molding,thermoforming or vacuum forming, or rotomolding processes can be used.Using a molding process, material can flow around first and secondelements 210 and 212, and the material can accommodate irregularitiesand defects of the elements, while subsequently changing state toprovide structural integrity and define an integral component with highdegrees of tolerance.

In some embodiments, a brazing process can be used instead of or inaddition to a molding process. For example, a dielectric compositematerial can be brazed between the first and second elements. In oneimplementation, a composite material can be placed in a fixture betweenthe first and second elements to be connected, and the compositematerial can be heated so that it melts and fills a region between theconductive elements (e.g., is distributed between the conductiveelements by capillary action or wetting). For example, the fixture andcomposite material can be placed in contact with a heated surfacecausing the composite material to heat and flow. The composite materialcan be cooled once it has filled the region between the conductiveelements, forming a secure bond between the composite material and eachof the conductive elements. Any suitable type of brazing can be usedincluding, for example, torch blazing, furnace brazing, braze welding,vacuum brazing, or dip brazing. The filler material can include anysuitable composite material, including various particular dielectric orinsulating composite materials such as, for example, plastic, rubber,organic composites, non-conductive metal alloys, or combinations ofthese. Furthermore, the geometry of features along internal surfaces ofthe conductive elements can be selected and designed to enhance thebrazed bond.

The elements connected by the intermediate element can include anysuitable feature for improving the adhesion between the elements and theintermediate element. FIGS. 3A-3C are schematic top views ofillustrative components that includes an intermediate element inaccordance with some embodiment of the invention. The components shownin FIGS. 3A-3C include first and second elements connected together byan intermediate element. The first and second elements can include anysuitable feature for improving a bond with the intermediate element. Insome embodiments, the elements can include one or more internal featuresthat provide an interlocking interface, or that increase the surfacearea required for adhering the intermediate element to the first andsecond elements. For example, an element can include a curved internalfeature (e.g., a spherical or cylindrical recess or protrusion) into oraround which material from the intermediate element can extend, thusincreasing a surface tension based force. As another example, an elementcan include a feature having one or more openings, holes, hooks or otherattributes that can engage a corresponding feature of the intermediateelement, once the intermediate element has transitioned to the secondstate (e.g., a hole in the first element into which a post of theintermediate element can extend). In some embodiments, a feature caninclude an interlock attribute such as, for example, a recessed edge ator near the interface between a recessed feature or a protrudingfeature, such that the recessed edge that forms a hook into whichmaterial from the intermediate element can flow.

Component 300 shown in FIG. 3A can be constructed by connecting firstelement 302 and second element 304 using intermediate element 306. Toimprove the adhesion between first element 302 and intermediate element306, first element 302 can include opening 308 within the body of thefirst element that is accessible from the surface of the first elementthat is in contact with intermediate element 306 by channel 309.Similarly, second element 304 can include opening 310 within the body ofsecond element 304 that is accessible from the surface of the firstelement that is in contact with intermediate element 306 by channel 311.The opening and channel can have any suitable size or shape including,for example, a shape selected such that the channel is smaller than theopening. This can ensure that material of intermediate element 306flowing into the opening cannot pass back through the channel, and thusimprove the retention of the intermediate member (e.g., the through boreor opening forms an undercut or interlock). The opening can have anysuitable shape including for example a curved or angled cross-section,or a variable cross-section. The opening can extend through some, orall, of the first or second element including, for example, through onlyan internal portion of the element (e.g., to prevent the material of theintermediate element extending in the opening from being exposed at anexternal surface of the element.

Component 320 shown in FIG. 3B can be constructed by connecting firstand second elements 322 and 324 using intermediate element 326. Toimprove the adhesion of intermediate element 326 to the first and secondelements, intermediate element 326 can include overflowing portions 328extending beyond the cross-section of the first and second elements,which comes into contact with exposed surfaces of the first and secondelements (e.g., surfaces other than the interfacing surfaces that opposeone another within the component). Overflowing portions 328 can extendover any suitable surface of the first and second elements including,for example, only over one or more of a top, bottom, front or backsurface, and/or along only one of the first and second elements, orvarious combinations of these.

Component 340 shown in FIG. 3C can be constructed by connecting firstand second elements 342 and 344 using intermediate element 346. Firstand second elements 342 and 344 can include openings 348 and 330, andchannels 349 and 331, respectively, as described above in connectionwith component 300. To allow openings 348 and 330 to extend through theentire height of the first and second components, while maintaininguniform and consistent external surfaces of the elements, the first andsecond elements can include chamfers 343 and 345, respectively,extending from a surface of the elements. For example, the chamfers canextend from an internal surface of the elements, such that the chamfersextend within an internal volume of a device that includes thecomponent. The chamfer can have any suitable height including, forexample, a height that matches that of the main body of each element, ora height that is less than that of the main body. In particular, thechamfers can be recessed relative to top and bottom surfaces of thefirst and second elements. Openings 348 and 330 can extend through thechamfers instead of or in addition to the main bodies of the elements.

As a result of the manufacturing process, however, the interface betweenthe elements and material used to connect the elements (e.g., thematerial of the intermediate element) may be discontinuous or includeexcess material. For example, as material is injected into a mold aspart of a molding process, excess material can seep through seams of themold, and extend beyond boundaries of an interface between theintermediate element and one of the first and second elements. Asanother example, material can warp or deform as it cools or heats duringthe connection process (e.g., when the material changes from the firststate to the second state). The resulting component can have an uneveninterface between the different materials. FIG. 4 is a schematic view ofan illustrative component constructed from several elements havingdifferent material properties in accordance with one embodiment of theinvention. Component 400 can be constructed by connecting first andsecond elements 410 and 412 using intermediate element 420.

First and second elements 410 and 412, and intermediate element 420 canbe constructed from any suitable material including, for example, atleast two different materials. For example, first and second elements410 and 412 can be constructed from a first material, and intermediateelement 420 can be constructed from a second material. The materialsselected can have different mechanical properties including, forexample, different modules of elasticity, tensile strength, compressivestrength, shear strength, yield strength, ductility, poisons ration, orcombinations of these. In some embodiments, the materials can instead orin addition have different electrical, thermal, chemical, magnetic,optical, acoustical, radiological, or manufacturing properties (e.g.,machining speeds and feeds, machinability rating, hardness, extruding ormolding temperature and pressure, or castability). For example, thefirst and second elements can be constructed from harder materials (orsofter materials), and the intermediate element can be constructed froma softer material (or a harder material). As another example, the firstand second elements can be constructed from conductive materials, andthe intermediate element can be constructed from an insulating material.As still another example, the first element can be constructed from athermally conductive material, and the second and intermediate elementscan be constructed from thermally insulating materials.

The manufacturing process used to connect first and second elements 410and 412 using intermediate element 420 can cause excess material toextend beyond desired boundaries or interfaces between the elements(e.g., a boundary in line with external surfaces of first and secondelements 410 and 412, such that the regions of intermediate element 420located in the vicinity of an interface with first element 410 andsecond element 412 fit within the cross-section of first and secondelements 410 and 412, respectively). In particular, a moldedintermediate element 420 can include undesirable excess material (e.g.,flash) around the interfaces between first element and intermediateelement 420, and between second element 412 and intermediate element420. For example, intermediate element 420 can include excess material421 and 422 along bottom and top surfaces of the element, and material423 along a left surface of the element. Excess material can extendbeyond the boundaries of one or more surfaces of the componentincluding, for example, around all external surfaces of the component(e.g., around the inner, outer, top and bottom surfaces of an outerperiphery member such as the one shown in FIG. 1). Material extendingbeyond final boundaries 402 and 404 on the top and bottom surfaces ofcomponent 400 may be undesirable and need to be removed. To provide afinal component that is aesthetically pleasing, the excess material ofat least the intermediate element, and in some cases the first andsecond elements as well, may be removed.

To ensure that the resulting component is aesthetically pleasing,elements 410 and 412 can be finished before being coupled to connectingelement 420. For example, elements 410 and 412 can be initially formedto have excess material (e.g., 0.2 mm of excess material) that can beremoved to ensure that the elements have smooth or continuous cosmeticsurfaces. In some cases, however, the external surfaces of elements 410and 412 may not be completely finished prior to coupling with theconnecting element. Instead, only some excess material can be removedfrom the surfaces (e.g., most excess material, leaving only 0.05 mm ofexcess material). The remaining excess material on external surfaces ofthe elements that may need to be removed to finish the component. Inparticular, first element 410 can include excess material 411, andsecond element 412 can include excess material 413. The excess materialcan take any suitable shape including, for example, seams, tool marks(e.g., from cold work), granular particles, protrusions or bumps, orcombinations of these. The excess material can be located on anysuitable surface of the elements including, for example, in regions nearor away from the interface with the intermediate element.

If first and second elements 410 and 412 are not finished, thecombination of first and second elements 410 and 412 with intermediateelement 420 can be processed to remove excess material and provide anaesthetically pleasing finish. This approach can limit the number ofmanufacturing steps required to manufacture the component, as a singlefinishing step can be used for first element 410, second element 412 andintermediate element 420. Any suitable process can be used tosimultaneously finish the elements. For example, a grinding process orother such process can be applied to component 400 to remove excessmaterial from all of the elements, including elements constructed fromdifferent materials. Other finishing processes can include, for example,machining, tumbling, etching, electroplating, anodizing,electropolishing, polishing, sandblasting, or combinations of these.

In some embodiments, the manufacturing process for one or more of thefirst element, second element, and intermediate element canintentionally leave excess material on the component (e.g., as shown inFIG. 4). Using this approach, a single finishing process can be used forthe entire component to ensure that the resulting component satisfiesindustrial design considerations. In particular, the final component(post-finishing process) can have a continuous surface across interfacesor seams between elements of the component.

Although the example of FIG. 4 shows a flat or planar surface betweenthe first and second elements, and the intermediate element, it will beunderstood that a single process can be used to remove excess materialfrom a surface having any suitable shape. For example, a single processcan be applied to a curved surface or a rounded surface. As anotherexample, a single process can be applied to a surface having one or moreangled sections (e.g., around corners of a rectangular cross-section).

In some embodiments, a single finishing process can be applieduniversally to all of the elements (having corresponding differentmaterial properties) in a component. For example, a single cutting toolcan be applied to all of the elements. As another example, a singlegrinder can be applied to the surfaces of the component. Alternatively,several tools or grinders can be applied to different surfaces of thecomponent. For example, different tools can be applied to metal andplastic elements to account for differences in mechanical properties ofthe elements.

In some embodiments, a single process or tool can be used for each ofthe elements. In some cases, the process or tool can be applied using asetting corresponding to a material property of one of the elements(e.g., the softest material) to prevent smearing or other damage to lessresistant materials. Alternatively, a single process or tool can be usedwith different settings. For example, a different force can be appliedto a tool operating on the component. As another example, a grinder canrotate at different speeds, or be pressed against the component withdifferent forces. The finishing process can be adjusted using anysuitable approach. In some embodiments, the machining apparatus caninclude one or more sensors for detecting the type of material that isprocessed, and can adjust the manner in which the material is processedbased on the detected material. Alternatively, an operator can specifythe type of material of each element being processed in an assembledcomponent. The apparatus can automatically adjust processing settings,or a user can manually change the settings.

FIG. 5 is a schematic view of an illustrative assembly for removingexcess material from front and back surfaces of a component constructedby connecting several elements in accordance with one embodiment of theinvention. Component 500 can be constructed by connecting first element510 and second element 520 together using material 505 (which can forman intermediate element). In some embodiments, excess material 505 canextend extending beyond boundaries of gap 508 between first element 510and second element 520. In particular, excess material 506 can extendbeyond front surface 511 of first element 510 and front surface 521 ofsecond element 520, and excess material 507 can extend beyond backsurface 512 of first element 510 and back surface 522 of second element520. The excess material can adversely affect the cosmetic appearance ofcomponent 500, and can in some cases in addition or instead affect thestructural integrity of the component (e.g., introduce stress points).In some embodiments, the tool used to provide material 505 can preventexcess material from extending past an interface along a particularplane (e.g., prevent excess material 507). In such cases, feweroperations may be required to remove the excess material and provide acosmetically acceptable component.

To remove excess material 506 and excess material 507, grinding orcutting tools 540 and 542 can be applied to the excess material. Forexample, cutting tool 540 can be moved towards the front surfaces 511and 521 (e.g., towards the excess material 506) in direction 550. Asanother example, cutting tool 540 can substantially rest on one or bothof back surfaces 512 and 522, and move laterally along the surface indirection 552 to remove excess material 507 extending beyond the surfacelevel (e.g., remove flash seeping out of a mold seam during a moldingprocess, where the flash constitutes undesired additional material of amolded element). In some embodiments, a single cutting tool can be usedsuccessively on the front and back surfaces of elements 510 and 520(instead of or in addition to using cutting both tools 540 and 542, forexample simultaneously).

In some embodiments, a grinding, cutting, or other process for removingmaterial can be applied to a component having opposing sidewalls (e.g.,forming a loop), such that material can be removed from inner and outersurfaces of the component at the same or different times. In particular,the process can be applied to a ring-like shaped component (e.g., anouter periphery member such as that shown in FIG. 1). FIG. 6 is aschematic view of an illustrative assembly for removing excess materialfrom a closed ring component in accordance with one embodiment of theinvention. Component 600 can be constructed from distinct elements 610,620 and 630 coupled to each other to form a ring. In particular,elements 610 and 620 can be coupled using intermediate element 605,elements 620 and 630 can be coupled using intermediate element 606, andelements 630 and 610 can be coupled using intermediate element 607.Elements 610, 620 and 630 can each include a curved or angular sectionto allow the combined component to form a loop. Intermediate elements605, 606 and 607 can be coupled to each of elements 610, 620 and 630using any suitable approach including, for example, molding, braising,or other approaches described above. In particular, the material(s) usedfor each of intermediate elements 605, 606 and 607 can be selected tochange from a first state in which it is placed between elements to asecond state in which it securely connects the elements. Because of themanufacturing approach used for connecting the component elements, someportions of intermediate elements 605, 606 and 607 can extend beyonddesired boundaries or interfaces, and may need to be removed. In somecases, one or more of elements 610, 620 and 630 can instead or inaddition include excess material extending beyond one or more desiredfinal surfaces of the elements.

To remove the excess material of one or more of elements 610, 620 and630, and intermediate elements 605, 606, and 607, grinding or cuttingtools 640 and 642 can be applied along inner and outer surfaces ofcomponent 600, for example as described above with respect to FIG. 5.The tools can move in any suitable direction including, for example,perpendicular to a component surface, or tangent to a component surface(e.g., following the shape of component 600). Tools 640 and 642 can beapplied at any suitable time including, for example, simultaneously orsequentially (e.g., in which case only a single tool can be used). Thecutting tools can remove material from one or more elements used toconstruct component 600 including, for example, removing material fromelements 610, 620 and 630, or material from the intermediate elements,such that the resulting component has a smooth and continuous surfaceacross the seams or interfaces between elements.

FIG. 7 is a flowchart of an illustrative process for finishing acomponent constructed from elements of different materials in accordancewith one embodiment in the invention. Process 700 can begin at step 702.At step 704, first and second elements can be provided. The first andsecond elements can be constructed from the same or different materials,or from materials having the same or different properties (e.g.,mechanical or manufacturing properties). For example, first and secondelements can be constructed from a metal (e.g., using cold work). Atstep 706, the first and second elements can be connected using anintermediate element. The intermediate element can be constructed fromany suitable material including, for example, a material selected suchthat at least two of the first, second and intermediate elements areconstructed from materials having different properties. For example, theintermediate element can be constructed from plastic. The first andsecond elements can be connected to the intermediate element using anysuitable approach including, for example, using molding or braising, asdescribed above. In some cases, the intermediate member can be providedin a first state between the first and second elements, and subsequentlychange to a second state to create a structural bond between the firstand second elements. At step 708, the first, second and intermediateelements can be processed using a single tool to define a uniformsurface across seams or interfaces between the elements. For example, asingle tool or process can be applied on a plane or surface of acomponent having an interface between different elements (e.g.,different tools can be used for different planes or surfaces, such asfront and back surfaces, but only a single tool can be used for aparticular plane or surface). In some cases, the first, second andintermediate elements can be processed to create a desired final shapeor surface property (e.g., a shape driven by industrial designconsiderations). For example, a grinding or cutting tool can be appliedto the elements to process a surface of the elements and an interfacebetween the elements. In some embodiments In some embodiments, the toolsettings can be adjusted for each element based on the material used forthe element, or on the properties of the material used for the element.Process 700 can end at step 710.

FIG. 8 is a flowchart of an illustrative process for adjusting settingsof a finishing apparatus in accordance with one embodiment of theinvention. Process 800 can begin at step 802. At step 804, an electronicdevice component constructed from several component elements connectedtogether can be placed in a finishing apparatus. The finishing apparatuscan include, for example, a machine or manufacturing process that canprovide an aesthetically pleasing finish for the component, or canremove excess material from the component. The individual componentelements can be connected using any suitable approach including, forexample, using material properties of one of the component elements. Forexample, one of the component elements can change from a first state inwhich the component element flows between other component elements to asecond state in which the component element structurally connects theother component elements to form an integral component. At step 806, theapparatus can detect a component element that is placed opposite a toolof the finishing apparatus. For example, the apparatus can detect theparticular portion of the component that will be processed by theapparatus. At step 808, the apparatus can identify the material of thedetected component element. For example, the apparatus can identify amaterial from a sensor (e.g., an optical sensor) used by the apparatus.As another example, the apparatus can determine the particular region ofthe component, and retrieve a material from a user provided descriptionof the component (e.g., the region corresponds to a small componentelement, which is known to be an intermediate element constructed fromplastic). As still another example, a user can provide information aboutthe material directly to the finishing apparatus. In some embodiments,the apparatus can instead or in addition identify a particular materialproperty that relates to the manner in which the tool is applied to thecomponent (e.g., instead of or in addition to the actual material).

At step 810, the apparatus can select settings for the apparatus thatcorrespond to the identified material. For example, the apparatus canselect a particular tool, force, or other apparatus setting based on thematerial. In particular, the amount of force applied to the componentelement can vary based on the material properties (e.g., apply lessforce to a softer material) of the component element. In someembodiments, the apparatus can select an apparatus setting thatcorresponds to the softest or less resistant of the component elementmaterials. At step 812, the apparatus can process the detected componentelement using the selected settings. For example, the apparatus canapply a tool to the component element with a force and at a speeddetermine from the apparatus settings. At step 814, the apparatus candetermine whether a new component element is detected. For example, theapparatus can determine, as a tool moves, whether the tool has reached anew component element. In some cases, the apparatus can instead or inaddition determine whether a new material has been detected. If theapparatus determines that a new component element has been detected,process 800 can move to step 808 and identify the material of the newcomponent element.

If, at step 814, the apparatus instead does not detect a new componentelement, process 800 can move to step 816. At step 816, the apparatuscan determine whether the entire component has been finished by thefinishing apparatus. If the apparatus determines that the entirecomponent has not been finished, process 800 can return to step 812 andcontinue to process the current component element. If, at step 816, theapparatus instead determines that the component has been entirelyfinished, process 800 can end at step 818.

The previously described embodiments are presented for purposes ofillustration and not of limitation. It is understood that one or morefeatures of an embodiment can be combined with one or more features ofanother embodiment to provide systems and/or methods without deviatingfrom the spirit and scope of the invention.

What is claimed is:
 1. An electronic device comprising: a display; anelectrical component operably coupled to an antenna; and an enclosure ofthe electrical component and the display, the enclosure comprising: afirst electrically-conductive element defining a first portion of anexternal surface of the electronic device; a secondelectrically-conductive element defining a second portion of theexternal surface of the electronic device; and an intermediateelectrically-insulating element bonded to and positioned at leastpartially between the first electrically-conductive element and thesecond electrically-conductive element, the intermediateelectrically-insulating element defining a third portion of the externalsurface.
 2. The electronic device of claim 1, wherein: the firstelectrically-conductive element is electrically insulated from thesecond electrically-conductive element by the intermediateelectrically-insulating element; and the intermediateelectrically-insulating element structurally couples the first andsecond electrically-conductive elements.
 3. The electronic device ofclaim 2, wherein: the first electrically-conductive element comprises aprotrusion extending from an internal surface; and the intermediateelectrically-insulating element is structurally coupled to theprotrusion.
 4. The electronic device of claim 3, wherein: the protrusiondefines an opening; and the intermediate electrically-insulating elementat least partially occupies the opening.
 5. The electronic device ofclaim 1, wherein the first electrically-conductive element forms atleast part of the antenna.
 6. The electronic device of claim 5, whereinthe first, second, and third portions cooperate to define asubstantially continuous surface.
 7. The electronic device of claim 1,wherein the intermediate electrically-insulating element is injectionmolded and at least partially fills an irregularity along a surface ofeither the first electrically-conductive element or the secondelectrically-conductive element.
 8. The electronic device of claim 1,wherein the intermediate electrically-insulating element at leastpartially fills a recess of either the first electrically-conductiveelement or the second electrically-conductive element.
 9. The electronicdevice of claim 1, wherein the intermediate electrically-insulatingelement permits passage of radio-frequency (RF) energy.
 10. An enclosurefor an electronic device, the enclosure comprising: a first conductiveelement defining a first portion of an exterior surface of theenclosure; a second conductive element defining a second portion of theexterior surface of the enclosure; and an intermediate elementpositioned at least partially between and bonded to the first conductiveelement and the second conductive element, the intermediate elementelectrically insulating the first conductive element from the secondconductive element and defining a third portion of the exterior surfaceof the enclosure.
 11. The enclosure of claim 10, wherein theintermediate element enables operation of an antenna of the electronicdevice.
 12. The enclosure of claim 10, wherein the first, second, andthird portions of the exterior surface of the enclosure cooperate todefine a smooth, continuous surface of an exterior wall of theenclosure.
 13. The enclosure of claim 10, wherein: the device enclosureis configured to house a display; the first conductive element defines aU-shaped upper portion of the device enclosure that extends across anentire side of the display.
 14. The enclosure of claim 10, wherein: theintermediate element is formed from a non-conductive material; and theintermediate element includes an overflow portion that is molded atleast partially over an interior surface of at least the firstconductive element or the second conductive element.
 15. The enclosureof claim 10, wherein: the first conductive element comprises aprotrusion extending from a first interior surface of the firstconductive element; and the second conductive element comprises aprotrusion extending from a second interior surface of the secondconductive element; and the protrusion of the first conductive elementand the protrusion of the second conductive element are structurallyengaged with the intermediate element.
 16. An enclosure for anelectronic device, the enclosure comprising: a first conductive elementdefining a first portion of an exterior wall of the enclosure; a secondconductive element defining a second portion of the exterior wall of theenclosure; and a non-conductive element defining a third portion of theexterior wall of the enclosure, the non-conductive element bonded to thefirst conductive element and the second conductive element.
 17. Thedevice enclosure of claim 16, wherein the first, second, and thirdportions of the exterior wall define a smooth, continuous exteriorsurface of the device enclosure.
 18. The device enclosure of claim 17,wherein the smooth, continuous exterior surface comprises a contouredsurface.
 19. The device enclosure of claim 16, wherein the firstconductive element comprises a curved portion of the enclosure.
 20. Thedevice enclosure of claim 16, wherein the exterior wall includes one ormore of: a top sidewall, a bottom sidewall, a right sidewall, or a leftsidewall of the enclosure.
 21. The device enclosure of claim 16,wherein: the first conductive element defines a first interlock feature;and the non-conductive element at least partially fills the firstinterlock feature.